Welcome to Huatian (ht) tECHNOLOGY group!
Navigation
Contact us
hotline
029-88785858
Address: Weiyang District of Fengcheng city of Xi'an province Shaanxi five road No. 105
location: Home > english > Products > progress capability
progress capability
source:Huatian (ht) tECHNOLOGY group
Process Capability
No.  Items Process Capability
1 Grinding and Wafer saw Diameter  4、5、6、8、12 inch
2  Min. Grinding Thickness 
Min=50μm (8 inch ,12 inch )
3 Min. Saw Street Width                   
Min=50μm
4 Min. Die bonding chip size 
Min=250*250μm
5 Die Attach  INK、MAPPING 
6 Die Bonding Method  Epoxy/Electrically insulating/Solder/DAF/WBC 
7 Wire Bonding Method  Gold wire, Copper wire, Alloy wire、Aluminum wire 
8 Au Wire Min. BPP (Bond Pad Pitch)  43 μm
9 Au Wire Min. BPO (Bond Pad Opening)  36 μm ×36 μm
10 Cu Wire Min. BPP (Bond Pad Pitch)  50 μm
11  Cu Wire Min. BPO (Bond Pad Opening)  40 μm ×40 μm
12  Al Wire Min. BPP (Bond Pad Pitch)  70 μm
13  Al Wire Min. BPO (Bond Pad Opening)  250μm×385μm
14  Bonding Wire diameter  18μm ~ 50μm
15  Bonding Wire length  0.1mm~6mm
16 Molding  Method  Single Mold, MGP Mold, automatic mold 
17  Plating Method   Pure Tin Plating 
18  Marking Method  Laser printing 
19  Forming and Singulation   incision, pressing 
20 Testing  We can provide testing solution upon customer’s request 
21 Lead Co-planarity  <3mil  小于75 um 
22 Packaging Method   Tube, Tray, Tape & Reel 
23 Bond pad metal for Au
Min=Al 0.4μm
24 Bond pad metal for Cu
Min=Al 0.8μm or AlCu & AlSiCu 0.6μm

Huatian (ht) tECHNOLOGY

Weiyang District of Fengcheng city of Xi'an province Shaanxi five road No. 105

technical support:幸运飞艇平台